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1

Effects of different test profiles of temperature cycling tests on the reliability of RFID tags

Lahokallio, Sanna, Saarinen-Pulli, Kirsi, Frisk, Laura

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.61 MB

english, 2015

2

High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates

Lahokallio, S., Kiilunen, J., Frisk, L.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 834 KB

english, 2014

3

Effects of different anisotropically conductive adhesives on the reliability of UHF RFID tags

Saarinen-Pulli, Kirsi, Lahokallio, Sanna, Frisk, Laura

Journal:

International Journal of Adhesion and Adhesives

Year:

2016

Language:

english

File:

PDF, 932 KB

english, 2016

4

Performance of a Polymer-Based Sensor Package at Extreme Temperature

Lahokallio, Sanna, Hoikkanen, Maija, Marttila, Tuomas, Vuorinen, Jyrki, Kiilunen, Janne, Frisk, Laura

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 2.39 MB

english, 2016

5

Stability and properties of PET Films in Electronics Applications in Hygrothermal Environments

Frisk, Laura, Lahokallio, Sanna, Kiilunen, Janne, Saarinen-Pulli, Kirsi

Journal:

Year:

2016

Language:

english

File:

PDF, 287 KB

english, 2016

6

[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Comparison of microvia HDI PCBs with ACF interconnections in accelerated life testing

Frisk, L., Lahokallio, S., Kiilunen, J.

Year:

2017

Language:

english

File:

PDF, 887 KB

english, 2017

7

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Reliability of isotropic electrically conductive adhesives under condensing humidity testing

Frisk, L., Lahokallio, S., Mostofizadeh, M., Kiilunen, J., Saarinen, K.

Year:

2012

Language:

english

File:

PDF, 1.04 MB

english, 2012

8

Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials

Sanna Lahokallio, Kirsi Saarinen, Laura Frisk

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 849 KB

english, 2013

9

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Usability of ECA materials in high temperature sensor applications

Lahokallio, Sanna, Frisk, Laura

Year:

2012

Language:

english

File:

PDF, 871 KB

english, 2012

10

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Reliability study of isotropic electrically conductive adhesives under thermal cycling testing

Frisk, Laura, Lahokallio, Sanna, Mostofizadeh, Milad, Kiilunen, Janne, Saarinen, Kirsi

Year:

2013

Language:

english

File:

PDF, 934 KB

english, 2013

11

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Performance of electrically conductive adhesive attached sensors in high temperature cycling

Lahokallio, Sanna, Frisk, Laura

Year:

2014

Language:

english

File:

PDF, 126 KB

english, 2014

12

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Electrically conductive adhesives for demanding temperature cycling environment with water immersions

Lahokallio, Sanna, Kiilunen, Janne, Frisk, Laura

Year:

2015

Language:

english

File:

PDF, 590 KB

english, 2015

13

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Thermal cycling reliability analysis of an anisotropic conductive adhesive attached large-area chip with area array configuration

Kiilunen, Janne, Lahokallio, Sanna, Frisk, Laura

Year:

2015

Language:

english

File:

PDF, 1.09 MB

english, 2015

14

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Performance of passive RFID tags in a high temperature cycling test

Lahokallio, Sanna, Kiilunen, Janne, Frisk, Laura

Year:

2014

Language:

english

File:

PDF, 1.15 MB

english, 2014

15

Performance of Anisotropically Conductive Adhesive Attachments on Adhesiveless Polyimide Substrate during High-Temperature Storage Tests

Lahokallio, Sanna, Frisk, Laura

Journal:

Year:

2016

Language:

english

File:

PDF, 279 KB

english, 2016

16

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - High density R2R screen printed silver interconnections for hybrid system integration

Kraft, Thomas M., Leppanen, Lydia, Kololuoma, Terho, Lahokallio, Sanna, Frisk, Laura, Mantysalo, Matti

Year:

2016

Language:

english

File:

PDF, 731 KB

english, 2016

17

Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure

Frisk, Laura, Lahokallio, Sanna, Mostofizadeh, Milad, Parviainen, Anniina, Kiilunen, Janne

Journal:

Procedia Engineering

Year:

2016

Language:

english

File:

PDF, 266 KB

english, 2016

18

High-Temperature Storage Testing of ACF Attached Sensor Structures

Lahokallio, Sanna, Hoikkanen, Maija, Vuorinen, Jyrki, Frisk, Laura

Journal:

Year:

2015

Language:

english

File:

PDF, 18.32 MB

english, 2015

19

[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - The transmittance properties of optical adhesives in humid environmental aging

Lahokallio, Sanna, Kiilunen, Janne, Frisk, Laura

Year:

2017

File:

PDF, 1.04 MB

2017

20

[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - The transmittance properties of optical adhesives in humid environmental aging

Lahokallio, Sanna, Kiilunen, Janne, Frisk, Laura

Year:

2017

Language:

english

File:

PDF, 1.04 MB

english, 2017

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